Fine Line Thick Film Hybrids

Our Fine Line Photoimageable Technology provides a low-cost, reliable way to achieve 20 µm lines with 30 µm gaps using a standard print-dry-fire process. The method is highly reproducible and supports high-yield, scalable production. Conventional thick film hybrids are restricted to 100 µm line/gap design rules. Achieving finer geometries demands costly precision machinery, specialized pastes, and mesh screens—yet yields remain low. Multilayers face additional issues due to the uneven, concave surface of screen-printed layers and the saw-tooth effect of mesh openings, which can break fine lines. Achieving high definition in LTCC layers is even more challenging.

The technology enables much higher circuit density with 20 µm lines featuring smooth, vertical walls—eliminating the saw-tooth effect and improving RF performance. Even existing 100 µm designs perform better due to improved line geometry. Designs can also be downsized to replace expensive thin-film components. Using polished alumina substrates, resolutions down to 10 µm are achievable in lab-scale production.

Fine line pastes produce uniform profiles without central valleys, while low-viscosity photo-dielectrics enable high-density multilayers with flat top surfaces—greatly improving wire bonding yield. The process works for both fired ceramics and LTCC. Paste chemistry supports multiple metals (Ag, Ag-Pd, Au, Pt) and compatible dielectric layers for fine vias and gaps. Mixed-metal applications, like Ag-Pd tracks with Au pads, are proven successful.

Fine line pastes are compatible with standard thick film materials and firing profiles, needed only in high-density areas to minimize cost. Ideal for sensors and compact layouts, the system requires just two additional units—exposure and developer—available in lab or automated versions. We provide full tooling and integration support for seamless adoption.